| Description |
| • | Various devices containing semiconductor are used in HPCU. And heat is generated when the HPCU operates. |
| • | These devices are connected to the high voltage directly and cause heat hotter than the electrical devices of an internal combustion engine. |
| • | Overheat reduces the efficiency of control devices, hindering operational control. Also, the semiconductor elements may melt under excessive heat (The device may remain constantly turned on.) Such overheat may become the cause of vehicle malfunction. |
| Hybrid Motor Cooling System Circuit |

Specifications Cooling system CoolantSpecified coolant LLC - 10 Quantity Approx. 3.2L (0.85 US gal, 3.38 US qt, 2.82 lmp qt.)
Inspection1.Turn the ignition switch OFF.2.Disconnect the mode control actuator connector.3.Verify that the mode control actuator operates to the defrost mode when connecting 12V to terminal 3 and grounding terminal 4.Verify that the mode control actuator operates to the vent mode when connected in reverse.
Removal • Put on gloves to prevent hand injuries. • When removing with a flat-tip screwdriver or remover, wrap protective tape around the tools to prevent damage to components.