| Description |
| • | Various devices containing semiconductor are used in HPCU. And heat is generated when the HPCU operates. |
| • | These devices are connected to the high voltage directly and cause heat hotter than the electrical devices of an internal combustion engine. |
| • | Overheat reduces the efficiency of control devices, hindering operational control. Also, the semiconductor elements may melt under excessive heat (The device may remain constantly turned on.) Such overheat may become the cause of vehicle malfunction. |
| Hybrid Motor Cooling System Circuit |

Specifications Cooling system CoolantSpecified coolant LLC - 10 Quantity Approx. 3.2L (0.85 US gal, 3.38 US qt, 2.82 lmp qt.)
Replacement1.Disconnect the negative (-) battery terminal. 2.Remove the heater and blower assembly.(Refer to Heater - "Heater Unit") 3.Remove the evaporator core cover (A) after loosening the mounting screws.4.Pull out the evaporator temperature sensor (A) from the evaporator core.
Inspection1.Disconnect the negative (-) battery terminal.2.Remove the crash pad lower panel.(Refer to Body - "Crash Pad Lower Panel")3.Remove the lower crash pad switch assembly (A) after disengaging the mounting clip.4.Remove the rheostat switch connector (A).