| Description |
| • | Various devices containing semiconductor are used in HPCU. And heat is generated when the HPCU operates. |
| • | These devices are connected to the high voltage directly and cause heat hotter than the electrical devices of an internal combustion engine. |
| • | Overheat reduces the efficiency of control devices, hindering operational control. Also, the semiconductor elements may melt under excessive heat (The device may remain constantly turned on.) Such overheat may become the cause of vehicle malfunction. |
| Hybrid Motor Cooling System Circuit |

Specifications Cooling system CoolantSpecified coolant LLC - 10 Quantity Approx. 3.2L (0.85 US gal, 3.38 US qt, 2.82 lmp qt.)
Removal1.Disconnect the negative (-) battery terminal.2.Remove the front / rear bumper cover.(Refer to Body - "Front Bumper Cover")(Refer to Body - "Rear Bumper Cover")3.Disconnect the connector (A) from the parking assist sensor.4.Remove the sensor (A) by pulling out both ends of the sensor holder.
System Block DiagramComponent Parts and Function Outline Component part Function Vehicle-speed sensor, ESP/ABS Control ModuleConverts vehicle speed to pulse.VCUReceives signals from sensor and control switches.