| Description |
| • | Various devices containing semiconductor are used in HPCU. And heat is generated when the HPCU operates. |
| • | These devices are connected to the high voltage directly and cause heat hotter than the electrical devices of an internal combustion engine. |
| • | Overheat reduces the efficiency of control devices, hindering operational control. Also, the semiconductor elements may melt under excessive heat (The device may remain constantly turned on.) Such overheat may become the cause of vehicle malfunction. |
| Hybrid Motor Cooling System Circuit |

Specifications Cooling system CoolantSpecified coolant LLC - 10 Quantity Approx. 3.2L (0.85 US gal, 3.38 US qt, 2.82 lmp qt.)
Description The photo sensor is located at the center of the defrost nozzles.The photo sensor contains a photovoltaic (sensitive to sunlight) diode. The solar radiation received by its light receiving portion, generates an electromotive force in proportion to the amount of radiation received which is transferred to the automatic temperature control
Inspection1.Check the resistance of the ambient temperature sensor between terminals 1 and 2 whether it changes by changing the ambient temperature.1. Ambient Sensor (+)2. Sensor groundSpecification Ambient temperature [°C (°F)] Resistance between terminal 1 and 2 (