| Description |
| • | Various devices containing semiconductor are used in HPCU. And heat is generated when the HPCU operates. |
| • | These devices are connected to the high voltage directly and cause heat hotter than the electrical devices of an internal combustion engine. |
| • | Overheat reduces the efficiency of control devices, hindering operational control. Also, the semiconductor elements may melt under excessive heat (The device may remain constantly turned on.) Such overheat may become the cause of vehicle malfunction. |
| Hybrid Motor Cooling System Circuit |

Specifications Cooling system CoolantSpecified coolant LLC - 10 Quantity Approx. 3.2L (0.85 US gal, 3.38 US qt, 2.82 lmp qt.)
Inspection • Before measuring the pressure of the refriferant line, check whether the refrigerant amount is charged in accordance with the specified charging amount.(Refer to Heating, Ventilation, Air Conditioning - "Specifications")1.
DescriptionThe evaporator temperature sensor will detect the evaporator core temperature and interrupt compressor relay power in order to prevent evaporator from freezing by excessive cooling. The evaporator temperature sensor has the Negative Temperature Coefficient (NTC).