| Description |
| • | Various devices containing semiconductor are used in HPCU. And heat is generated when the HPCU operates. |
| • | These devices are connected to the high voltage directly and cause heat hotter than the electrical devices of an internal combustion engine. |
| • | Overheat reduces the efficiency of control devices, hindering operational control. Also, the semiconductor elements may melt under excessive heat (The device may remain constantly turned on.) Such overheat may become the cause of vehicle malfunction. |
| Hybrid Motor Cooling System Circuit |

Specifications Cooling system CoolantSpecified coolant LLC - 10 Quantity Approx. 3.2L (0.85 US gal, 3.38 US qt, 2.82 lmp qt.)
Component Location1. Blower unit assembly Components1. Duct Seal2. Intake duct case3. Air intake door assembly4. Intake door5. Seal6. Intake duct case (A)7. Air filter cover (A)8. Intake actuator9. Air filter cover10. Air filter 11. Blower unit pad12.
Replacement When prying with a flat-tip screwdriver or use a prying trim tool, wrap it with protective tape, and apply protective tape around the related parts, to prevent damage.1.Disconnect the negative (-) battery terminal.2.Recover the refrigerant with a recovery / recycling / charging station.